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[ ] Udemy - Advanced Materials For Electronics Packaging

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文件列表

  1. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.mp4 37MB
  2. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.mp4 21MB
  3. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.mp4 21MB
  4. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.mp4 20MB
  5. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.mp4 19MB
  6. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.mp4 19MB
  7. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).mp4 18MB
  8. ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.mp4 17MB
  9. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.mp4 15MB
  10. ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.mp4 15MB
  11. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).mp4 14MB
  12. ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.mp4 14MB
  13. ~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.mp4 14MB
  14. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .mp4 13MB
  15. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.mp4 12MB
  16. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.mp4 12MB
  17. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.mp4 11MB
  18. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.mp4 11MB
  19. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.mp4 11MB
  20. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.mp4 10MB
  21. ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.mp4 10MB
  22. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.mp4 9MB
  23. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.mp4 9MB
  24. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.mp4 9MB
  25. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.mp4 7MB
  26. ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.mp4 6MB
  27. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.mp4 6MB
  28. ~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.mp4 6MB
  29. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.mp4 6MB
  30. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.mp4 6MB
  31. ~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.mp4 5MB
  32. ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1.1 RESOURCE.pdf 4MB
  33. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/1. INTRODUCTION TO SUBSTRATE MATERIALS CERAMIC POLYMERES METALS COMPOSITES.srt 4KB
  34. ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/1. SINGLE-IN-LINE DUAL-IN-LINE ZIGZAG-IN-LINE QUAD -IN-LINE CONFIGURATIONS.srt 3KB
  35. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/3. ELECTRONIC GLASS.srt 3KB
  36. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/3. WHAT IS ELECTRONICS PACKAGING & ITS 2 BROAD CATEGORIES.srt 3KB
  37. ~Get Your Files Here !/7. PHASE CHANGE MATERIALS/1. MATERIALS USED IN PCM.srt 3KB
  38. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/2. TYPES OF CIRCUIT BOARD & ITS APPLICATIONS.srt 2KB
  39. ~Get Your Files Here !/3. ELECTRONICS SUBSTRATE MATERIALS & THEIR FUNCTIONS IN THERMAL MANAGEMENT/2. VARIOUS TYPES CERAMIC SUBSTRATE MATERIALS.srt 2KB
  40. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/1. INTRODUCTION TO MMCs.srt 2KB
  41. ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/1. USE OF GELVET OVER CONVENTIONAL TIMs.srt 2KB
  42. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/9. CARBON NANO TUBES (CNTs).srt 2KB
  43. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/3. FR4 PCB BOARD.srt 2KB
  44. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/6. HIERARCHY OF ELECTRONICS PACKAGING.srt 2KB
  45. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/3. Al-SiC MMC.srt 2KB
  46. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/8. ROLE OF DIAMOND.srt 2KB
  47. ~Get Your Files Here !/2. PACKAGING CONFIGURATIONS/2. CERAMIC-FLAT-PACK SURFACE-MOUNT GRID-ARRAY-MATRIX CONFIGURATIONS.srt 2KB
  48. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/2. Al-DIAMOND MMC.srt 2KB
  49. ~Get Your Files Here !/5. ADVANCED MATERIAL FOR TIM/2. TECHNICAL DETAILS & CERTAIN DRAWBACKS OF GELVET TIMs.srt 2KB
  50. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/5. Cu-DIAMOND MMC.srt 2KB
  51. ~Get Your Files Here !/9. COURSE CLOSING SESSION/1. CONCLUSION.srt 2KB
  52. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/2. OVERVIEW OF COURSE CONTENTS.srt 1KB
  53. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/7. GOLD-GOLD INTERCONNECTION (GGI).srt 1KB
  54. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/7. 3 PACKAGING VARIATIONS CARD DCAM MCML.srt 1KB
  55. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/4. WHY DO WE NEED DEVICE PACKAGING COATING .srt 1KB
  56. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/5. APPLICATIONS OF MATERIALS IN ELECTRONICS PACKAGING.srt 1KB
  57. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/6. Al-GRAPHITE MMC.srt 1KB
  58. ~Get Your Files Here !/4. YOUR PCB SUBSTRATE A GUIDE TO MATERIALS/1. INTRODUCTION TO PCB.srt 1023B
  59. ~Get Your Files Here !/6. METAL MATRIX COMPOSITES (MMCs) OF HIGH THERMAL CONDUCTIVITY/4. Al-Si MMC.srt 887B
  60. ~Get Your Files Here !/8. ELECTROMAGNETIC SHIELDING (EMI)/1. ADVANCED MATERIALS USED FOR EMI SHIELDING IN ELECTRONICS.srt 849B
  61. ~Get Your Files Here !/9. COURSE CLOSING SESSION/2. CLOSING SESSION.srt 819B
  62. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/8. CONCEPT OF CHIP FIRST & CHIP LAST.srt 703B
  63. ~Get Your Files Here !/1. INTRODUCTIONOVERVIEW/1. SELF INTRODUCTION.srt 593B
  64. ~Get Your Files Here !/Bonus Resources.txt 357B
  65. Get Bonus Downloads Here.url 176B